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product structure silicon monolithic integrated circuit this product is not designed prot ection against radioactive rays 1/16 tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 14? 001 datashee t constant current led driver with 64 dimming steps for up to 4 leds bd1754hfn general description the multi-level brightness control led works as a constant current driver in 64 steps, so that the driving current can be adjusted finely. bd1754hfn is best suited to turn on leds that require high-accuracy led brightness control. features ? current regulation for led up to 4 parallels ? adjustable constant current 64 steps ? high accuracy and matching of each current channel (0.5% typ.) ? brightness control via a single-line digital control interface (uni-port interface control = upic) applications this driver can be used in various fields such as mobile phones, portable game machines and etc. typical application circuit key specification ? operating power supply voltage range: 2.7v to 5.5v ? quiescent current: 0.1 a (typ.) ? operating temperature range: -30c to +85c package w(typ.) x d(typ.) x h(max.) figure 2. application circuit hson8 2.90mm x 3.00mm x 0.60mm figure 1. hson8 bd1754hfn vin iset gnd en l4 l3 l2 l1 power su pp l y 0.1 f 120k ? (when iled-max =32ma) cin r iset
2/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 absolute maximum ratings (ta = 25c) parameter symbol ratings unit terminal voltage vmax 7 v power dissipation pd 630 (*1) mw operating temperature ran ge topr -30 to +85 c storage temperature range tstg -55 to +150 c (*1) this value is the measurement value when the driver is mounted on a glass epoxy board (70 mm x 70 mm x 1.6 mm). when using the driver at ta of 25c or higher, the power is dissipated by approx. 5.04 mw/c. recommended operating ratings (ta = -30c to +85c) parameter symbol limits unit condition min. typ. max. operating power supply vo ltage vin 2.7 3.6 5.5 v driver pin voltage range vdrv 0.2 - vi n-1.4 v when current driver power on. electrical characteristics (unless otherwise specified, ta = 25c and vin = 3.6 v) parameter symbol limits unit condition min. typ. max. quiescent current iq - 0.1 1 a en=0v circuit current idd - 1.2 2. 0 ma except led current [current driver] maximum current iled-max 29.76 32.0 34.24 ma r iset = 120k ? led current accuracy iled-diff - - 7.0 % when current 16.5 ma setting r iset = 120k ? led current matching iled-match - 0.5 3.0 ( * 1) % when current 16.5 ma setting r iset = 120k ? [logic controller] low threshold voltage vil - - 0.4 v high threshold voltage vih 1.4 - - v ?h? level input current iih - 0 2 a en=vin ?l? level input current iil -2 0 - a en=0v en ?h? time thi 0.05 - 100 s en ?l? time tlo 0.3 - 100 s en off time-out toff 1 - - ms vin supply -> en active time tvinon 1 - - ms en stand-by -> vin off time tvinoff 0 - - ms (*1) the following formula is used for calculation: iled-match = {(imax - im in) / (imax + imin)} x 100 imax = current value in a channel with the maximum current value among all channels imin = current value in a channel with the minimum current value among all channels
3/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 pin descriptions no. pin name in/ out esd diode functions for power for gnd 1 en in vin gnd led enable and brightness control signal 2 gnd - vin - ground 3 iset out vin gnd bias current 4 vin - - gnd power supply voltage input 5 l1 in - gnd current sink for led 1 6 l2 in - gnd current sink for led 2 7 l3 in - gnd current sink for led 3 8 l4 in - gnd current sink for led 4 - thermal pad - - - heat radiation pad of back side connect to gnd block diagram figure 3. block diagram vin iset gnd current dac upic 6 en l2 l1 l4 l3
4/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves figure 4. quiescent current ta=-30,25,85 figure 5. circuit current ta = 8 5 ta = 2 5 ta = - 3 0 figure 6. led off-leakage current ta=-30,25,85 figure 7. led output current vs. led pin voltage (vin = 3.6 v, at 32 ma of led current) ta=-30,25,85
5/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves - continued figure 8. led output current vs. vin (at 32 ma of led current) ta=-30,25,85 figure 9. led current characteristics (vin = 3.6 v, differential linearity error) ta=-30,25,85 figure 10. led current characteristics (vin = 3.6 v, integral linearity error) ta=-30,25,85 figure 11. led current relative accuracy (vin = 3.6 v) ta = 8 5 ta = 2 5 ta = - 3 0
6/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 typical performance curves - continued figure 12. led current vs. r iset (vin = 3.6 v, at the maximum current setting) r iset [k ? ]
7/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 description of operations (1) upic (= uni-port interface control) interface bd1754hfn has a single-line digital control interface (upic) that can control the power on/off and led current value through the en pin. the led current decreases by o ne step depending on the number of rising edges. after the number of rising edge is reached to the mi nimum output current (64 rising edges), the next rising edge changes the output current to the maximum value at st artup time. to maintain any output cu rrent, the en pin must be kept at ?h? level. to power off, the en pin must be kept at ?l? level for more than 1ms. max current max current en iled (internal) state c64 c63 c62 c61 c62 c60 c2 c1 c64 c63 thi tlo toff off off min current off off figure 13. brightness control method en thi tlo toff figure 14. upic interface by following sequence, upic can control current driver for max current and off state only. figure 15. upic interface usage for max current or off only max max en iled (internal) state c64 c64 toff off off off toff off off off
8/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 (2) current driver the max current is determined by the iset resistance and the following formula. iled-max [ma] = 6.4 x 600 [mv] / r iset [k ? ] the led current state can be changed by the en control signal. when the state is c n , the output current (iled) can be obtained from the following formula (where, n indicates a state number). iled [ma] = iled-max x n / 64 the following table is the example of led current, when iset resistance is 120 [k ? ]. r iset : 120[k ? ] state output current [ma] state output current [ma] state output current [ma] state output current [ma] c64 32.0 c48 24.0 c32 16.0 c16 8.0 c63 31.5 c47 23.5 c31 15.5 c15 7.5 c62 31.0 c46 23.0 c30 15.0 c14 7.0 c61 30.5 c45 22.5 c29 14.5 c13 6.5 c60 30.0 c44 22.0 c28 14.0 c12 6.0 c59 29.5 c43 21.5 c27 13.5 c11 5.5 c58 29.0 c42 21.0 c26 13.0 c10 5.0 c57 28.5 c41 20.5 c25 12.5 c9 4.5 c56 28.0 c40 20.0 c24 12.0 c8 4.0 c55 27.5 c39 19.5 c23 11.5 c7 3.5 c54 27.0 c38 19.0 c22 11.0 c6 3.0 c53 26.5 c37 18.5 c21 10.5 c5 2.5 c52 26.0 c36 18.0 c20 10.0 c4 2.0 c51 25.5 c35 17.5 c19 9.5 c3 1.5 c50 25.0 c34 17.0 c18 9.0 c2 1.0 c49 24.5 c33 16.5 c17 8.5 c1 0.5 when the state is c64 (the maximum value), the output current value can be changed on the iset resistance value as below. state : c64 iset resistance value (k ? ) output current per channel (ma) total output current of the four channels (ma) 240 16.0 64.0 120 32.0 128.0 90 42.7 170.8 60 64.0 256.0
9/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 application circuit examples (1) circuit example when the power supply is separated vin iset gnd current dac upic 6 en l4 l3 l2 l1 on the assumption that vf is 3 v power supply2=5v 0.1f 120k ? the voltage value of l* pin must be vin-1.4 v at the maximum when the led is powered on. power supply1 (when iled -max =32ma) (maximum rating = 7.0 v) cin r ise t (ex.) figure 16. circuit example when the power supply is separated this figure shows a circuit example when the power supply fo r vin and for leds is separa ted. apply a voltage of vf (threshold voltage value of a white led) or higher to the led. in this case, please note that when the led is powered on, the voltage value of l* pin (each pin of l1 to l4) must be vin-1.4 v at the maximum. if a voltage of higher than vin-1.4 v is applied to l* pin, a desired current value can not be obtained. also, please pay attention to the voltage application procedure at start-up. be sure to power the current driver on using the upic after applying power supply voltages to the vin and the led-anode pins . if the current driver is powered on prior to applying power supply voltages to the led, a rush current occurs in the led. determine the resistance value with which the led current value is maximized and then connect such resistor betw een the iset and the gnd pins. the power on/off and the brightness of the leds are controlled through the en pin in accordance with the upic format. (2) circuit example when using only two leds 120k ? vi n iset gnd current dac upic 6 en l2 l1 0.1f connect to the gnd pin. (when iled-max =32ma) cin r ise t l4 l3 figure 17. circuit example when using only two leds this figure shows a circuit example when none of l3 and l4 leds are used. connect both of the unused l3 and l4 pins to the gnd pin. likewise, it is possible to make the l1 and/or the l2 pins unused, which allows the back lights to be used with the one or three led(s) turned on. in all cases, connect the unused l* pin to the gnd pin. determine the resistance value with which the led current value is maxi mized and then connect such resistor between the iset and the gnd pins. the power on/off and the brightness of the leds are controll ed through the en pin in accordance with the upic format.
10/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 (3) circuit example when the en pin is powered on at all times rs vin iset gnd current dac upic 6 en l2 l1 0.1 f cs l 4 l3 (when iled-max =32ma) 120k ? cin r ise t figure 18. circuit example when the en pin is powered on at all times this figure shows a circuit example when the en pin is powered on at all times. to prevent a rush current from occurring in the driver, it is necessary to apply voltages to the vin pin and the leds prior to powering the current driver on. mount an rc filter between t he vin and the en pins to delay the en pin rising against the power-supply voltage rising. determine the resistance value with which the led cu rrent value is maximized and then connect such resistor between the iset and the gnd pins. (4) circuit example when performing a pwm brightness control vin iset gnd current dac upic 6 en l2 l1 0.1f pwm 1m ? 120k ? l4 l3 cin r iset figure 19. circuit example when performing a pwm brightness control this figure shows a circuit example when performing a pwm br ightness control. through switching the iset resistance value by the pwm input signal, the led current is outputt ed under a pwm mode. the en signal is controlled by an applied voltage level. in the circuit example shown above, t he led current value is changed to 3.43 ma in 0 % of the pwm duty cycle, 17.72 ma in 50 % of that and 32 ma in 100 % of that.
11/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 (5) circuit example when driving a large current with only one led powered on. vin iset gnd current dac upic 6 en l2 l1 0.1f l4 l3 (when iled-max =32ma) 120k ? iled=128ma cin r ise t figure 20. circuit example when driving a large current with only one led powered on. this figure shows a circuit example when driving a larg e current through all of four channels with only one led powered on. by shorting out all the led driv er pins, in the example of using 120 k ? r iset , a current up to 128 ma (32 ma x 4) can be driven. in this exam ple, the brightness can be adjusted in 64 gradations with 2 ma step (0.5 ma step/channel x 4 channels). for higher current values, using 60 k ? r iset allows a current up to 256 ma to be driven into one of the leds. the power on/off and the brightne ss of the leds are controlled through the en pin in accordance with the upic format. (6) circuit example when making the eight leds available by connecting the two bd1754hfn drivers vin iset gnd current dac upic 6 en l2 l1 0.1f l4 l3 (when iled-max =32ma) 120k ? iled=32ma vin iset gnd current dac upic 6 en l2 l1 l4 l3 (when iled-max =32ma) 120k ? iled=32ma 0.1f cin r ise t cin r ise t figure 21. circuit example when making the eight leds available by connecting the two bd1754hfn drivers this figure shows a circuit example when making eight leds available by connecting two bd1754hfn drivers. by connecting the control signals to the en pins in parall el, the eight led channels can be controlled concurrently. this parallel connection scheme can increase the number of the led channels further as necessary (such as twelve, sixteen, or more). determine the resistance value with which the led current value is maximized and then connect such resistor between the iset and the gnd pins. the power on/off and the brightness of the leds are controlled through the en pin in accordance with the upic format.
12/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 (7) circuit example when connecting the two leds to each of the channels in series vin iset gnd current dac upic 6 en l4 l3 l2 l1 power supply2=6.2~7v 0.1f 120k ? the voltage value of l* pin must be vin-1.4 v at the maximum when the led is powered on. power supply1 (when iled -max =32ma) (maximum rating = 7.0 v) on the assumption that vf is 3 v (ex.) figure 22. circuit example when connecting the two leds to each of the channels in series this figure shows a circuit example when making 8 (2 x 4) leds available by connecting two leds to each of the channels in series. in this example, when vf is set to appr ox. 3 v in order to ensure the voltage to l1 through l4 pins, it is necessary to apply a voltage of 6.2 v (3 v x 2 led?s in se ries + 0.2 v of the minimum vo ltage value of the driver pin) or higher to the led anode pin as its power supply voltage. pay attention that the volt age should not exceed the 7.0-v maximum rating of the l1 through l4 pins. determine the resistance value with which the led current value is maximized and then connect such resistor between the iset and the gnd pins. the power on/off and the brightness of the leds are controlled through t he en pin in accordance with the upic format.
13/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 selection of components externally connected symbol recommended value recommended component manufacturer cin 0.1f grm188b31h104ka92b murata symbol recommended value recommended component manufacturer r iset 120k ? mcr10pzhzf1203 rohm recommended pcb layout design pcb pattern to provide low impedance for the wiring to the power supply line. also, provide a bypass capacitor if needed. figure 23. layout image of the application components (top view) figure 24. surface (top view) pad is used for improving the efficiency of ic heat radiation. solder pad to gnd pin. moreover, connect ground plane (gnd) of board using via as shown in the patterns of next page. the efficiency of heat radiation improves according to the area of ground plane (gnd). l4 l2 l1 l3 en iset vin gnd en gnd cin r iset led_pwr vin led_pwr en gnd vin r iset cin connect cin input-bypass capacitor in close proximity between the vin and gnd pins. connect the r iset resistor in close proximity to the iset pin.
14/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 operational notes (1) absolute maximum ratings an excess in the absolute maximum ratings, such as appli ed voltage, temperature range of operating conditions, can break down devices, thus making impossible to identify breaking mode such as a short circuit or an open circuit. if any special mode exceeding the absolute maximum ratings is assu med, consideration should be given to take physical safety measures including the use of fuses, etc. (2) recommended operating conditions these conditions represent a range within which characteri stics can be provided appr oximately as expected. the electrical characteristics are guarante ed under the conditions of each para meter. the voltage and temperature characteristics are also shown under the c onditions in respect of electrical ones. (3) reverse connection of power supply connector the reverse connection of power supply connector can break down ics. take protective measures against the breakdown due to the reverse connection, such as mounting an exter nal diode between the power supply and the ic?s power supply terminal. (4) power supply line design pcb pattern to provide low impedance for t he wiring between the power supply and the gnd lines. furthermore, for all power supply terminals to ics, mount a capacitor between the power supply and the gnd terminal. at the same time, in order to use an electrolytic capacitor, thoroughly check to be sure that the characteristics of the capacitor to be used present no problem including the occurrence of capacity dropout at a low temperature, thus determining the constant. (5) gnd voltage make setting of the potential of the g nd terminal so that it will be maintained at the minimum in any operating state. furthermore, check to be sure that no terminal is operat ed at a potential lower than the gnd voltage including an actual electric transient. (6) short circuit between terminals and erroneous mounting in order to mount ics on a set pcb, pay thorough attention to the direction and offset of the ics. erroneous mounting can break down the ics. furthermore, if a short circuit occurs due to foreign matters entering between terminals or between the terminal and the power supply or the gnd terminal, the ics can break down. (7) operation in strong electromagnetic field be noted that using ics in the strong elec tromagnetic field can cause a malfunction. (8) inspection with set pcb on the inspection with the set pcb, if a capacitor is connect ed to a low-impedance ic terminal, the ic can suffer stress. therefore, be sure to discharge from the set pcb by each process. furthermore, in order to mount or dismount the set pcb to/from the jig for the inspection process, be sure to turn off the power supply and then mount the set pcb to the jig. after the completion of the inspection, be sure to tu rn off the power supply and then dismount it from the jig. in addition, for protection against static electricity, establis h a ground for the assembly process and pay thorough attention to the transportation and t he storage of the set pcb. (9) input terminals in terms of the construction of ic, parasitic elements are in evitably formed in relation to potential. the oper ation of the parasitic element can cause interference with circuit operati on, thus resulting in a malfunction and then breakdown of the input terminal. therefore, pay thorough attention not to handle the input termi nals, such as to apply to the input terminals a voltage lower than that applied to the gnd res pectively, so that any parasitic element will operate. furthermore, do not apply a voltage to the input terminals when no power supply voltage is applied to the ic. in addition, even if the power supply voltage is applied, apply to the input terminals a voltage lower than the power supply voltage or within the guaranteed value of electrical characteristics. (10) ground wiring pattern if small-signal gnd and large-current gn d are provided, it will be recommended to separate the large-current gnd pattern from the small-signal gnd pattern and establish a si ngle ground at the reference poi nt of the set pcb so that resistance to the wiring pattern and voltage fluctuations due to a large current will cause no fluctuations in voltages of the small-signal gnd. pay att entio n not to cause fluctuations in the gnd wiring pattern of external parts as well. (11) thermal design perform thermal design in which there are adequate margins by taking into account the permissible dissipation (pd) in actual states of use. status of this document the japanese version of this document is fo rmal specification. a customer may use this translation version only for a reference to help reading the formal version. if there are any differences in translation version of this document formal version takes priority.
15/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 ordering information b d 1 7 5 4 h f n - t r part number package hfn: hson8 packaging and forming specification tr: embossed tape and reel marking diagram physical dimension tape and reel information (unit : mm) hson8 s 0.08 m 0.1 s 0.320.1 0.65 0.02 +0.03 ?0.02 0.6max 8765 43 12 2.8 0.1 2.9 0.1 3.0 0.2 (max 3.1 include burr) 0.475 1pin mark 5 4 6 32 7 1 8 (0.2) (1.8) (0.15) (2.2) (0.3) (0.45) (0.2) (0.05) 0.13 +0.1 ?0.05 direction of feed reel ? order quantity needs to be multiple of the minimum quantity. embossed carrier tape tape quantity direction of feed the direction is the 1pin of product is at the upper right when you hold reel on the left hand and you pull out the tape on the right hand 3000pcs tr () 1pin hson8 (top view) 754 bd1 1pin mark part number marking lot number
16/16 bd1754hfn datasheet tsz02201-0g3g0c200060-1-2 9.nov.2012 rev.001 www.rohm.com ? 2012 rohm co., ltd. all rights reserved. tsz22111 ? 15? 001 revision history date revision changes 09.nov.2012 001 new release
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. notice general precaution 1) before you use our products, you are requested to care fully read this document and fully understand its contents. rohm shall not be in any way responsible or liable for fa ilure, malfunction or accident arising from the use of any rohm?s products against warning, caution or note contained in this document. 2) all information contained in this document is current as of the issuing date and subjec t to change without any prior notice. before purchasing or using rohm?s products, please confirm the la test information with a rohm sales representative. precaution on using rohm products 1) our products are designed and manufactured for applicat ion in ordinary electronic equipments (such as av equipment, oa equipment, telecommunication equipment, home electroni c appliances, amusement equipment, etc.). if you intend to use our products in devices requiring extremel y high reliability (such as medical equipment, transport equipment, traffic equipment, aircraft/spacecra ft, nuclear power controllers, fuel c ontrollers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property (?specific applications?), please consult with the rohm sale s representative in advance. unless otherwise agreed in writing by rohm in advance, rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ro hm?s products for specific applications. 2) rohm designs and manufactures its products subject to strict quality control system. however, semiconductor products can fail or malfunction at a certain rate. please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe desi gn against the physical injury, damage to any property, which a failure or malfunction of our products may cause. the following are examples of safety measures: [a] installation of protection circuits or other protective devices to improve system safety [b] installation of redundant circuits to reduce the impact of single or multiple circuit failure 3) our products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditio ns, as exemplified below. accordin gly, rohm shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of an y rohm?s products under any special or extraordinary environments or conditions. if you intend to use our products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] use of our products in any types of liquid, incl uding water, oils, chemicals, and organic solvents [b] use of our products outdoors or in places where the products are exposed to direct sunlight or dust [c] use of our products in places where the products ar e exposed to sea wind or corrosive gases, including cl 2 , h 2 s, nh 3 , so 2 , and no 2 [d] use of our products in places where the products are exposed to static electricity or electromagnetic waves [e] use of our products in proximity to heat-producing components, plastic cords, or other flammable items [f] sealing or coating our products with resin or other coating materials [g] use of our products without cleaning residue of flux (ev en if you use no-clean type fluxes, cleaning residue of flux is recommended); or washing our products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] use of the products in places subject to dew condensation 4) the products are not subjec t to radiation-proof design. 5) please verify and confirm characteristics of the final or mounted products in using the products. 6) in particular, if a transient load (a large amount of load applied in a short per iod of time, such as pulse) is applied, confirmation of performance characteristics after on-boar d mounting is strongly recomm ended. avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading c ondition may negatively affect product performance and reliability. 7) de-rate power dissipation (pd) depending on ambient temper ature (ta). when used in seal ed area, confirm the actual ambient temperature. 8) confirm that operation temperature is within t he specified range described in the product specification. 9) rohm shall not be in any way responsible or liable for fa ilure induced under deviant condi tion from what is defined in this document.
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. precaution for mounting / circuit board design 1) when a highly active halogenous (chlori ne, bromine, etc.) flux is used, the resi due of flux may negatively affect product performance and reliability. 2) in principle, the reflow soldering method must be used; if flow soldering method is preferred, please consult with the rohm representative in advance. for details, please refer to rohm mounting specification precautions regarding application examples and external circuits 1) if change is made to the constant of an external circuit, pl ease allow a sufficient margin considering variations of the characteristics of the products and external components, including transient characteri stics, as well as static characteristics. 2) you agree that application notes, re ference designs, and associated data and in formation contained in this document are presented only as guidance for products use. theref ore, in case you use such information, you are solely responsible for it and you must exercise your own indepen dent verification and judgment in the use of such information contained in this document. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. precaution for electrostatic this product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. please take proper caution in your manufacturing process and storage so that voltage exceeding t he products maximum rating will not be applied to products. please take special care under dry condit ion (e.g. grounding of human body / equipment / solder iron, isolation from charged objects, se tting of ionizer, friction prevention and temperature / humidity control). precaution for storage / transportation 1) product performance and soldered connections may deteriora te if the products are stor ed in the places where: [a] the products are exposed to sea winds or corros ive gases, including cl2, h2s, nh3, so2, and no2 [b] the temperature or humidity exceeds those recommended by rohm [c] the products are exposed to di rect sunshine or condensation [d] the products are exposed to high electrostatic 2) even under rohm recommended storage c ondition, solderability of products out of recommended storage time period may be degraded. it is strongly recommended to confirm sol derability before using products of which storage time is exceeding the recommended storage time period. 3) store / transport cartons in the co rrect direction, which is indicated on a carton with a symbol. otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4) use products within the specified time after opening a humidity barrier bag. baking is required before using products of which storage time is exceeding the recommended storage time period. precaution for product label qr code printed on rohm products label is for rohm?s internal use only. precaution for disposition when disposing products please dispose them proper ly using an authorized industry waste company. precaution for foreign exchange and foreign trade act since our products might fall under cont rolled goods prescribed by the applicable foreign exchange and foreign trade act, please consult with rohm representative in case of export. precaution regarding intellectual property rights 1) all information and data including but not limited to application example contained in this document is for reference only. rohm does not warrant that foregoi ng information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. rohm shall not be in any way responsible or liable for infringement of any intellectual property rights or ot her damages arising from use of such information or data.: 2) no license, expressly or implied, is granted hereby under any intellectual property rights or other rights of rohm or any third parties with respect to the information contained in this document.
datasheet datasheet notice - rev.003 ? 2012 rohm co., ltd. all rights reserved. other precaution 1) the information contained in this document is provi ded on an ?as is? basis and rohm does not warrant that all information contained in this document is accurate and/or error-free. rohm shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties resulting from inaccuracy or errors of or concerning such information. 2) this document may not be reprinted or reproduced, in whol e or in part, without prior written consent of rohm. 3) the products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of rohm. 4) in no event shall you use in any way whatsoever the pr oducts and the related technical information contained in the products or this document for any military purposes, incl uding but not limited to, the development of mass-destruction weapons. 5) the proper names of companies or products described in this document are trademarks or registered trademarks of rohm, its affiliated companies or third parties.

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